ALEXANDRIA, Va., July 15 -- United States Patent no. 12,661,748, issued on June 23, was assigned to KEDE NUMERICAL CONTROL Co. LTD. (Dalian, China). "High-speed nut rotating feeding lead screw device... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,661,749, issued on June 23, was assigned to ABB SCHWEIZ AG (Baden, Switzerland). "Loading and unloading for automatic guided vehicle" was inven... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,661,750, issued on June 23. "Machine tool, position information correction method, and position information correction program" was invented by... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,661,751, issued on June 23, was assigned to SMW-Autoblok Spannsysteme GmbH (Meckenbeuren, Germany). "Chuck" was invented by Eckhard Maurer (Obe... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,661,752, issued on June 23, was assigned to DMG MORI Co. LTD. (Nara, Japan). "Machine tool and display control device" was invented by Megumi O... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,661,753, issued on June 23, was assigned to Blue Origin Manufacturing LLC (Huntsville, Ala.). "Modular bore polishing devices, and associated s... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,661,754, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Zone-based CMP target control" was ... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,661,755, issued on June 23, was assigned to Marposs Societa' Per Azioni (Bentivoglio, Italy). "Monitoring system for a movable component connec... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,661,756, issued on June 23, was assigned to DISCO Corp. (Tokyo). "Method of grinding workpiece including two grinding steps" was invented by Ma... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,661,757, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Polishing apparatus for a substrate and poli... Read More